Our extensive ESD protected Printed Circuit Board Assembly facilities enables us to meet the most demanding applications, embracing Surface Mount and Conventional Through-HoleTechnologies.

State of the art convection reflow and wave soldering equipment ensures controlled soldering of PCB components following automatic or hand placement.

Our Philips/Assembleon pick and place equipment with LCS ( large component sequencer ), configured in line along with a Sigma AX400 solder paste printer and Essemtec convection reflow solder oven, provides the platform to dedicate one of four SMT lines to meet higher batch size applications.

Additional capabilty is provided by three Quadra SMT based lines which provide a flexible ' fast set up ' service to meet customer requirements for low to medium batch production runs and prototyping applications.

Our fully trained operators assemble the widest range of highly complex boards to Industry Standard IPC-A-610D Class 3.


 click here for more detail on our surface mount capabilities 


 click here for more detail on our conventional through hole capabilities