Surface Mount PCB Assembly (SMT)

Four dedicated Surface Mount lines allow for double sided precision placement of up to 120,000 placements per day, ranging from fine pitch placement of QFP’s and BGA’s to 0402 chips.

The soldering of complex Surface Mount PCB’s requires an exact controlled soldering process.

Our Essemtec RO400FC reflow ovens can handle both lead free or lead based PCB assemblies.

This pure convection oven allowing post and homogonous heating with convection technology and microprocessor management, backed up with specialist profiling software to ensure accurate heating of the PCB.

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