The surface mount process consists of three basic stages :-

1. Screen Printing ( solder paste application )

SIGMA PRINT AX400 (1)
SP100 (1)                                          
TWS (2)

Accurate control of the solder paste screen printing process is paramount for reliable surface mount PCB assembly.The solder paste screen must be lined up accurately to the PCB before it is printed. Computer control ( Sigma Print AX400 ) virtually eliminates the possibility of mis-aligned solder paste prints. Once the process variables are finalised the data is stored on line allowing fast and accurate set up for future batches. We operate screen (stainless steel) printing machines with manual and fully automatic fiducial alignment. We use SAC387 lead free solder paste with no clean flux.

2. Surface Mount Pick & Place
 

Component range :   01005 (0402 ) to 54 x 54mm,                             45 x 100mm (BGA, uBGA, Connector, Odds)                             Max height : 20mm      Tape Feeders :   Max 120 (8mm tape)                 Trays :   LCS with 40 pallets                              Stick, tube, waffle pack etc           Board size :   Max 460 x 440mm : min 50 x 50mm   Board Thickness :   0.4 to 4.0mm

High speed line

Sigma Print AX400 screen printer x 1
Philips Topaz ( 8 heads full vision alignment ) x 1                        
Philips Eclipse (2 heads full vision alignment ) x 1                          
Philips LCS ( large component tray handler) x 1
Essemtec RO400FC convection reflow oven x 1

EC's high speed Philips based line, operates ' on the fly ' co-planarity and nozzle head exchange with ultra -high feeder count optimization. Capable of placement speeds of up to 20k components per hour, this high thoughput line provides the basis for handling applications where large batch processing is required.   Powerful software allows set up offline or on the machines, providing complete flexibility in the development and loading of new jobs. Once the programs are optimized, data is stored to guarantee that the correct program and vision information is loaded each time.

Low to medium speed lines

SP100 screen printer x 1
TWS screen printer x 3 
TWS Quadra SMD Mounter x 3
(automatic fiducial recognition ) 
Essemtec RO400FC convection reflow oven x 1

EC's low to medium speed lines are based on the rapidly configurable and highly durable Quadra pick & place machines. The Quadra's proven reliablity and durability is based on a comparitvely simple mechanical design with no delicate mechanisms and is the ideal workhorse for small to medium batch and protyping applications.

3. Reflow Soldering

Essemtec RO400FC x 2

Full convection heating
Universal mesh conveyor
5 convection modules
micoprocessor controlled with pre defined profiles
for lead- free or lead based solder paste or glue hardening
exit ramp for completed soldered PCB's

The soldering of complex SMD PCBs and new housing technologies requires an exact controlled soldering process. The RO400FC is a pure convection oven, allowing fast and homogenous heating. The implemented convection technology uses a vertical airflow for efficient heat transfer making soldering of lead-free components possible. The temperature of the three pre-heating zones and the two peak zones, along with the conveyor speed, are programmable to obtain the required soldering profile. Measuring the zone temperatures in the convection airflow, directly at the height of the PCB, guarantees reproducable results. Different suggested profiles for solder and glue are already integrated in the microprocessor control. The universal mesh conveyor system is the ideal solution for productions with frequent PCB changeover.