Low Pressure Overmoulding encapsulates and protects of PCB & Cable Assemblies.
It is an innovative encapsulation process positioned between traditional potting and injection moulding technologies. It is a complimentary technology. It does not replace all potting applications and typically doesn‘t compete with traditional injection moulding.
LPO is an injection process whereby a PCB assembly, for example, is placed in a specially manufactured aluminium mould tool, and completely surrounded
( overmoulded ) with a liquid compound that effectively forms the housing for the device.
There are many benefits of Low Pressure Overmoulding:
Our Overmoulding Service capabilities and benefits: