E346021UK | Romania | Hong Kong + 44 ( 0 ) 1256 461894Copyright EC Electronics Limited 2012Surface Mount PCB Assembly ( SMT )Our high speed Philips Assembleon surface mount lines provide optimal double sided precision placement of up to 200,000 smd components per day.Components range from 0402 to large connectors (45mm x 100mm), fine pitch QFP’s, BGA’s, uBGA’s, CSP’s up to 20mm tall. The two lines operate the VICS2500 proprietary vision system with ' on the fly ' co-planarity and nozzle head exchange giving ultra -high feeder count optimization.Optimal placement speeds of up to 15k components per hour, means EC’s high thoughput Philips lines provide the basis for handling applications where large batch processing is required. System control is manged via the onboard MCX processor and VIOS ( Visual Integrated Operating System ) user interface.This powerful software allows set up offline or on the machines, providing complete flexibility in the development and loading of new jobs. Once the programs are optimized, data is stored to guarantee that the correct program and vision information is loaded each time.The surface mount process consists of three basic stages :-1. Screen Printing ( Solder Paste Application )SIGMA PRINT AX400 Accurate control of the solder paste screen printing process is paramount for reliable surface mount PCB assembly.The solder paste screen must be lined up accurately to the PCB before it is printed.Computer control ( Sigma Print AX400 ) virtually eliminates the possibility of mis-aligned solder paste prints. Once the process variables are finalised the data is stored on line allowing fast and accurate set up for future batches.We operate screen (stainless steel) printing machines with manual and fully automatic fiducial alignment. We use SAC387 lead free solder paste with no clean flux.2. Surface Mount Pick & Place with AOI Component Range : 0402 to 54 x 54mm, SOP, SOJ, PLCC, QFP, BGA, uBGA Max height : 6.5mm (Topaz):20mm (Eclipse) Tape Feeders : Max 120 (8mm tape) Trays : LCS with 40 pallets, Stick, tube, waffle pack Board size : Max 460 x 440mm : min 50 x 50mm Board Thickness : 0.4 to 4.0mmThe soldering of complex SMD PCBs and new housing technologies requires an exact controlled soldering process. The RO400FC is a pure convection oven, allowing fast and homogenous heating. The implemented convection technology uses a vertical airflow for efficient heat transfer making soldering of lead-free components possible.The temperature of the three pre-heating zones and the two peak zones, along with the conveyor speed, are programmable to obtain the required soldering profile. Measuring the zone temperatures in the convection airflow, directly at the height of the PCB, guarantees reproducable results. Different suggested profiles for solder and glue are already integrated in the microprocessor control. The universal mesh conveyor system is the ideal solution for productions with frequent PCB changeover. Philips Assembleon High Speed SMT Lines•Sigma Print AX400 screen printer x 2•Philips Topaz ( 8 heads full vision alignment ) x 2 •Philips Eclipse (2 heads full vision alignment ) x 1 •Philips LCS ( large component tray handler) x 1•Essemtec RO400FC convection reflow oven x 2•V-Score PCB Depaneliser x 1 •Yestech F1S Automated Optical Inspection x 1•Yestech ScanSpection AOI x 13. Reflow SolderingEssemtec RO400FC
E346021
UK | Romania | Hong Kong
+ 44 ( 0 ) 1256 461894
Copyright EC Electronics Limited 2012
Surface Mount PCB Assembly ( SMT )
Our high speed Philips Assembleon surface mount lines provide optimal double
sided precision placement of up to 200,000 smd components per day.
Components range from 0402 to large connectors (45mm x 100mm), fine pitch
QFP’s, BGA’s, uBGA’s, CSP’s up to 20mm tall. The two lines operate the
VICS2500 proprietary vision system with ' on the fly ' co-planarity and nozzle
head exchange giving ultra -high feeder count optimization.
Optimal placement speeds of up to 15k components per hour, means EC’s high
thoughput Philips lines provide the basis for handling applications where large
batch processing is required. System control is manged via the onboard MCX
processor and VIOS ( Visual Integrated Operating System ) user interface.
This powerful software allows set up offline or on the machines, providing
complete flexibility in the development and loading of new jobs. Once the
programs are optimized, data is stored to guarantee that the correct program
and vision information is loaded each time.
The surface mount process consists of three basic stages :-
1. Screen Printing ( Solder Paste Application )
SIGMA PRINT AX400
Accurate control of the solder paste screen printing
process is paramount for reliable surface mount PCB
assembly.The solder paste screen must be lined up
accurately to the PCB before it is printed.
Computer control ( Sigma Print AX400 ) virtually
eliminates the possibility of mis-aligned solder paste
prints. Once the process variables are finalised the data
is stored on line allowing fast and accurate set up
for future batches.
We operate screen (stainless steel) printing machines
with manual and fully automatic fiducial alignment. We
use SAC387 lead free solder paste with no clean flux.
2. Surface Mount Pick & Place with AOI
Component Range : 0402 to 54 x 54mm, SOP, SOJ, PLCC,
QFP, BGA, uBGA
Max height : 6.5mm (Topaz):20mm (Eclipse)
Tape Feeders : Max 120 (8mm tape)
Trays : LCS with 40 pallets, Stick, tube,
waffle pack
Board size : Max 460 x 440mm : min 50 x 50mm
Board Thickness : 0.4 to 4.0mm
The soldering of complex SMD PCBs and new housing technologies
requires an exact controlled soldering process. The RO400FC is a
pure convection oven, allowing fast and homogenous heating. The
implemented convection technology uses a vertical airflow for
efficient heat transfer making soldering of lead-free components
possible.
The temperature of the three pre-heating zones and the two peak
zones, along with the conveyor speed, are programmable to obtain
the required soldering profile. Measuring the zone temperatures in
the convection airflow, directly at the height of the PCB, guarantees
reproducable results. Different suggested profiles for solder and glue
are already integrated in the microprocessor control. The universal
mesh conveyor system is the ideal solution for productions with
frequent PCB changeover.
Philips Assembleon High Speed SMT Lines
•
Sigma Print AX400 screen printer x 2
•
Philips Topaz ( 8 heads full vision alignment ) x 2
•
Philips Eclipse (2 heads full vision alignment ) x 1
•
Philips LCS ( large component tray handler) x 1
•
Essemtec RO400FC convection reflow oven x 2
•
V-Score PCB Depaneliser x 1
•
Yestech F1S Automated Optical Inspection x 1
•
Yestech ScanSpection AOI x 1
3. Reflow Soldering
Essemtec RO400FC
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