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Surface Mount PCB Assembly (SMT)
Four dedicated Surface Mount lines allow for double sided precision placement of
up to 200,000 smd components per day. Components can range from 01005
(0402) to large connectors (45mm x 100mm), fine pitch QFP’s, BGA’s,
uBGA's, CSP's and up to 20mm tall.
Accurate control of the solder paste screen printing
process is paramount for reliable surface mount PCB
assembly.The solder paste screen must be lined up
accurately to the PCB before it is printed.
Computer control ( Sigma Print AX400 ) virtually
eliminates the possibility of mis-aligned solder paste
prints. Once the process variables are finalised the data is
stored on line allowing fast and accurate set up for future
batches.
We operate screen (stainless steel) printing machines with
manual and fully automatic fiducial alignment. We use
SAC387 lead free solder paste with no clean flux.
2. Surface Mount Pick & Place
Component range : 01005 (0402 ) to 54 x 54mm,
45 x 100mm (BGA, uBGA,
Connector, Odds)
Max height : 20mm
Tape Feeders : Max 120 (8mm tape)
Trays : LCS with 40 pallets
Stick, tube, waffle pack etc
Board size : Max 460 x 440mm : min 50 x
50mm
Board Thickness : 0.4 to 4.0mm
High speed line
Sigma Print AX400 screen printer x 1
Philips Topaz ( 8 heads full vision alignment ) x 1
Philips Eclipse (2 heads full vision alignment ) x 1
Philips LCS ( large component tray handler) x 1
Essemtec RO400FC convection reflow oven x 1
EC's high speed Philips based line, operates ' on the fly '
co-planarity and nozzle head exchange with ultra -high
feeder count optimization. Capable of placement speeds
of up to 20k components per hour, this high
thoughput line provides the basis for handling applications
where large batch processing is required.
Powerful software allows set up offline or on the
machines, providing complete flexibility in the
development and loading of new jobs. Once the programs
are optimized, data is stored to guarantee that the correct
program and vision information is loaded each time.
Low to medium speed lines
SP100 screen printer x 1
TWS screen printer x 3
TWS Quadra SMD Mounter x 3
(automatic fiducial recognition )
Essemtec RO400FC convection reflow oven x 1
EC's low to medium speed lines are based on the
rapidly configurable and highly durable Quadra pick &
place machines. The Quadra's proven reliablity and
durability is based on a comparitvely simple mechanical
design with no delicate mechanisms and is the ideal
workhorse for small to medium batch and protyping
applications.
3. Reflow Soldering
Essemtec RO400FC x 2
Full convection heating
Universal mesh conveyor
5 convection modules
micoprocessor controlled with pre defined profiles
for lead- free or lead based solder paste or glue hardening
exit ramp for completed soldered PCB's
The soldering of complex SMD PCBs and new housing
technologies requires an exact controlled soldering process.
The RO400FC is a pure convection oven, allowing fast and
homogenous heating. The implemented convection
technology uses a vertical airflow for efficient heat transfer
making soldering of lead-free components possible.
The temperature of the three pre-heating zones and the two
peak zones, along with the conveyor speed, are
programmable to obtain the required soldering profile.
Measuring the zone temperatures in the convection airflow,
directly at the height of the PCB, guarantees reproducable
results. Different suggested profiles for solder and glue are
already integrated in the microprocessor control. The
universal mesh conveyor system is the ideal solution for
productions with frequent PCB changeover.
The surface mount process consists of three basic stages :-
1. Screen Printing ( solder paste application )
SIGMA PRINT AX400 (1)
SP100 (1)
TWS (2)
EC installs high speed
YESTech FS1 AOI system
EC opens larger factory
in Petrosani, Romania
EC installs a new Sigma
AX400 screen printer in
it's Basingstoke surface
mount line
EC installs high speed YESTech FS1 AOI system for automated PCB Test and Inspection
Copyright EC Electronics Limited 2009
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