YESTech’s advanced Thin Camera™ technology offers high-speed PCB inspection with
exceptional defect coverage. With up top-down viewing cameras and four side viewing
cameras, the F1-Series inspects solder joints and verifies correct part assembly enabling
users to improve quality and increase throughput.
Programming the F-Series is fast and intuitive. Operators typically take less than 30
minutes to create a complete inspection program including solder inspection. The F1-
Series utilizes a standard package library to simplify training and insure program
portability across manufacturing lines.
Newly available image processing technology integrates several techniques, including
colour, normalized correlation and rule-based algorithms, to provide complete inspection
coverage with an extremely low false failure rate.
Configurable for all line positions, the F1-Series is equally effective for paste, pre / post-
reflow or final assembly inspection. Off-line programming maximizes machine utilization
and real-time SPC monitoring provides a valuable yield enhancement solution.